To meet the demands of next-generation Dynamic Random Access Memory (DRAM), the road map calls for 3D scaling. From high aspect ratio etching to 3D memory architectures, we make higher-density, more efficient memory possible. Learn more in the video. | Lam Research Corporation

Modern CPU devices consume significant energy and experience delays in timing caused by the data movement between the CPU and off-chip memory—enter, Resistive Random Access Memory (ReRAM), a promising solution for next-generation CPU applications. Learn more about ReRAM and how it can resolve two major problems within modern CPU devices. https://bit.ly/3Ukpdrg | Lam Research Corporation