Researchers stack silicon circuits vertically to build 3D chips that could extend Moore's law beyond current limits.

Forward-looking: For years, the chip industry has chased better performance by shrinking transistors and squeezing more of them onto a flat slice of silicon. That strategy is running into hard limits.

And it cost a whole lot less than an Amazon Echo.

A new method called PackUV compresses massive 3D video data into everyday video formats, potentially bringing immersive video experiences closer to home televisions and computers.

Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

If you're looking for the best way to play your old Nintendo games but don't have original hardware, these retro-inspired consoles have you covered.

Japan’s Kioxia has set the mass production of its next-generation NAND flash memory as a top priority for next year — a move ...

Huawei unveiled 122TB enterprise SSDs using Die-on-Board packaging that boosts density 33%, working around US export controls ...

Infleqtion is one of the leaders in applying the neutral atom modality to quantum computing delivering room-temperature scalable quantum computing.

This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than ...

Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with content, and download exclusive resources. Dany Lepage discusses the architectural ...

An ultra-compact, low-power 150 GHz radio module enabling high data rates in mobile devices has been developed by researchers from Japan. Targeting 6G user equipment, the proposed design integrates a ...