The mobile device manufacturer showcased a prototype design featuring interchangeable components in an ultra-slim form factor at a technology exhibition.

Designing and deploying DSPs FPGAs aren’t the only programmable hardware option, or the only option challenged by AI. While AI makes it easier to design DSPs, there are rising complexities due to the ...

AI-driven innovative technology brand TECNO is set to unveil its groundbreaking Modular Magnetic Interconnection Technology at MWC 2026. This concept, embodied by TECNO Modular Phone, represents TECNO ...

Broadcom (AVGO) said that it expects to sell at least 1M chips by 2027 based on its stacked design technology.

By Max A. Cherney SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech ...

Callosum, founded by two Cambridge-trained neuroscientists and inspired in part by the brain, has a system for optimizing ...