Research on optoelectronic integration — referring to the application of optical communication technology to computing — is ...

EPS for ~3-day lanes, polyurethane for higher performance, and vacuum insulation panels for maximum duration—still anchor ...

Taiwan Semiconductor Manufacturing Co plans to open a chip packaging plant in Arizona by 2029, an executive ​told Reuters.

Nextek and Coveris launch COtooCLEAN plant to recycle mixed films into food-grade resins using advanced CO₂ technology ...

About 30% of plastics consumed are made to last forever but are discarded after a single use. Researchers at Virginia Tech ...

The challenge for Videplast was to create a packaging solution that matched the stiffness, toughness, and aesthetic qualities ...

Your talk at Extech 1 is focused on the characterization of recycled polyolefines as future food contact materials. What is ...

Companies will co-innovate to bridge the gap between front-end manufacturing and back-end testing of semiconductors and advanced packaging ...

Advanced packaging allows multiple small chips to be connected, protected and tested to create a final larger chip like a graphics processing unit. Nvidia has reserved the majority of capacity at ...

There's a new bottleneck in AI chipmaking that almost all happens in Asia right now: advanced packaging. It connects smaller chips together into a larger chip like a GPU. As Nvidia books the majority ...

The takeaway: Intel is betting that advanced chip packaging, not just new process nodes, will power its comeback – and it is now in talks with Google and Amazon about advanced AI chip packaging ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...