Flip chip ball grid array (FC-BGA) packages are preferred in high-performance computing and advanced packages because of their superior signal integrity, high input/output density, good thermal ...

We take a closer look at what goes into developing new behaviors with Spot using RL research, and why pushing hardware to its limits through athletic feats helps make a better ro ...

The tipster further claimed that Lenovo will showcase the Lenovo Legion Go 2 gaming handheld device with Steam OS at the IFA event. A prototype for the second-generation Legion Go was shown at CES ...