The article explains the unique SI and PI challenges in 3D IC designs by contrasting them with traditional SoCs.
Abstract: This paper presents equivalent Thévenin circuits for two connections (parallel-series (ps) and parallel-parallel (pp)), for the magnetic coupling coils (resonators), used in wireless active ...
Abstract: Optimizing high-performance power electronic equipment, such as power converters, requires multiscale simulations that incorporate the physics of power semiconductor devices and the dynamics ...
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