Abstract: One of the technical challenges in 2.5D SiP is thermal issue increase with higher performance. In this paper, mass reflow bonding with molded underfll process for chip to wafer stacking of ...
Abstract: Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D semiconductor package structure. In this ...
[2460468:0x39b68020] 2907050 ms: Mark-Compact 2084.4 (2096.0) -> 2041.0 (2057.0) MB, 25.50 / 0.00 ms (average mu = 0.826, current mu = 0.872) allocation failure; scavenge might not succeed ...
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