Abstract: To address the challenge of ensuring a submarine can smoothly pass through a strait and complete its mission, this article proposes using a magnetic decoy array to simulate the submarine’s ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
This coredump's reliably on klayout 0.30.4 build on Mac with qt5-release or qt6-debug and on qt5 wsl ubuntu. Full log in tar file. ERROR: AddressSanitizer: heap-use-after-free on address ...
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