Design-Reuse

GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric® and Advanced Process Technologies

SAN JOSE, California – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to ...
TechNode

Xiaohongshu’s REDLAND turns a shipyard island into a 2.5D theme park for China’s gaming generation

Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up On August 8th, under the weight of Shanghai’s ...
Frontiers

Assessment of prostate cancer aggressiveness through the combined analysis of prostate MRI and 2.5D deep learning models

Objective: Prostate cancer is prevalent among older men. Although this malignancy has a relatively low mortality rate, its aggressiveness is critical in determining patient prognosis and treatment ...
TweakTown

New God of War game reportedly a 2.5D game, much smaller than initially predicted

TL;DR: Insiders reveal a new God of War project is in development, shifting from earlier rumors of a Greek prequel to a smaller-scale, Metroidvania-style spinoff. While details remain unconfirmed, ...
Business Wire

Unity to Support Developers Targeting Nintendo Switch 2 for Launch

SAN FRANCISCO--(BUSINESS WIRE)--Unity (NYSE: U), the leading platform to create and grow games and interactive experiences, today announced that it will provide game developers with official support ...
PC Gamer

2 years into Unity's long downward spiral, even more employees are being laid off as CEO says it's still 'stretched across too many products'

Gaming Industry Until Dawn developer Supermassive Games set to lay off another 36 employees after a 'redundancy consultation process', delays Directive 8020 to 2026 Gaming Industry We're still feeling ...
Electronic Design

Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...
SiliconANGLE

Report: Apple’s M5 chips will use TSMC’s N3P process and 2.5D packaging technologies

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...
Semiconductor Engineering

ESD Verification For 2.5D And 3D-ICs

Ensuring your integrated circuit (IC) design can withstand electrostatic discharge (ESD) events without incurring damage or failure is an extremely important activity in IC circuit design and ...
EDN

Broadcom launches 3.5D custom AI accelerator platform

Broadcom Inc. has announced the availability of its 3.5D eXtreme Dimension system-in-package (XDSiP) platform technology to develop next-generation custom AI accelerators (XPUs), claiming breakthrough ...
marktechpost

Google AI Introduces the Open Buildings 2.5D Temporal Dataset that Tracks Building Changes Across the Global South

Governments and humanitarian organizations need reliable data on building and infrastructure changes over time to manage urbanization, allocate resources, and respond to crises. However, many regions ...