The revised road plan presents the 200 Series, which employs dual-die design produced using CoWoS-L technology. Systems in the 300 Series include single-die (CoWoS-S) and dual-die (CoWoS-L).

TSMC plans to roll out CoWoS-L with 4,719 mm² interposers and 100×100 mm substrates, supporting up to 12 HBM stacks—likely targeting Nvidia’s Rubin lineup and other heavyweight compute gear.

TL;DR: NVIDIA’s B300 AI chip production is accelerated to May, utilizing TSMC’s advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs ...

But that's not enough for future applications. Sometimes next year, or a bit later, TSMC plans to introduce the next generation of its CoWoS-L packaging technology, which will support interposers ...

From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April, and the ...

We recently published a list of Top 11 AI News and Ratings You Should Take a Look At. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE ...

Nvidia is pushing production of its new B300 AI chip forward to May, using Taiwan Semiconductor Manufacturing’s latest 5nm (N4P) process and CoWoS-L advanced packaging technology. Sources at ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...

Figures from TrendForce, suggest that NVIDIA is planning to strategically promote the B300 and GB300 lines - which utilise CoWoS-L technology – in 2025, which would help to boost the demand for ...

Contrary to market rumors suggesting a reduction in Nvidia’s 2025 CoWoS wafer production plan at TSMC from more than 400,000 wafers to 380,000, Kuo’s findings indicate no such decrease.