The brand toughened up its popular family SUV, but first, the design and engineering team had to agree on the dimensions and ...
As more companies and startups join forces with government and academia in chip design projects, issues around data sharing, ...
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Data modeling and lab experiments could lead to energy-efficient paper manufacturing
Paper manufacturing is very energy-intensive, but there is great potential for improving energy efficiency. In a ...
Learn how prompt engineering transforms AI tools like ChatGPT into powerful assets. Discover frameworks for crafting ...
The new approach allows researchers to identify and optimize material recipes to more effectively encapsulate ...
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...
Tech Xplore on MSN
Technique makes complex 3D printed parts more reliable
MIT engineers are incorporating the limitations of 3D printers into computer designs, to better control materials’ performance. The approach helps ensure printed structures perform the way they’re ...
Prepping for Pack Expo 2025, Anoosheh Oskouian, CEO, Ship & Shore Environmental, Inc., provided a backgrounder on what ...
Design teams are under pressure to integrate more functionality in less time. Structured metadata and automation help manage ...
The $50 billion liquefied natural gas project — a 50:50 joint venture between Shell and YPF — will use output from the ...
Siemens Digital Industries Software announced today Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations of the traditionally serial ...
By leveraging the Protein Mutation Effect Predictor (ProMEP), AI-AncBE4max, a high-performance Cas9 variant with eight mutations, was developed, significantly enhancing the efficiency of BE systems, ...
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