Abstract: In this paper, a high-resistivity silicon (HR-Si) interposer integrated with through-silicon via (TSV) electrically grounded coplanar waveguide (CPW) line is presented for 2.5-D/3-D ...
Abstract: Transmitter/Receiver (T/R) is a basic part for the RF front-end module, whose miniaturization and integration are very important for the improvement in integration density, function ...
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