Semiconductor Engineering

Smarter Packaging: How AI is Reshaping Assembly and Materials Control

From predictive maintenance to excursion monitoring, AI is redefining yield management in multi-die assembly. When a ...
EurekAlert!

New software tool aims to help scientists better analyze complex spatial data from tissues

Researchers at the Icahn School of Medicine at Mount Sinai in New York, Boston Medical Center, and Boston University ...

Software tool helps scientists interpret complex spatial data across healthy and diseased tissue

Researchers at the Icahn School of Medicine at Mount Sinai in New York, Boston Medical Center, and Boston University ...

Meta’s new CWM model learns how code works, not just what it looks like

Moving beyond static code prediction, the model learns an internal world model of computational environments for more ...
IEEE

Note: A Data Envelopment Analysis Approach for Efficiency Evaluation of USA Metropolitan Statistical Areas’ Innovation Systems

Abstract: This study aims to evaluate the innovation system of the metropolitan statistical areas (MSAs) in the USA through the application of a two-stage data envelopment analysis model. Our ...