Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

From low-friction coatings to ultrasonic clamp load testing, early design integration and advanced joint analysis are ...

Have you ever noticed how wireless tech helps devices talk without wires, making homes, cities, and health smarter. Small ...

Your Raspberry Pi is already a pretty compact and complete package, and if you get smart with it, it's also very, very ...

Confused by APT, DNF, PACMAN, or Zypper? This guide explains the default package managers of various Linux distributions.

SiTime launches Titan Platform™, entering the $4B resonator space with the timing market’s smallest, most integrated ...

Over a year ago, we took a look at importing a .step file of a KiCad PCB into FreeCAD, then placing a sketch and extruding it ...

SiTime has launched the Titan Platform, a new family of MEMS resonators that are at least 4x smaller than the smallest legacy quartz alternatives.

Renesas Electronics has taped out—and is now sampling—3 nm (nanometre) chips designed by its Noida and Bengaluru teams for ...

Infineon Technologies is launching new 25V and 40V versions of the OptiMOS 7 power MOSFET family for industrial and consumer ...

For SoC and MCU makers, Titan delivers a turnkey timing solution that reduces support burdens, eliminates resonator-related ...

At the same time, the tradionell PCB industry is projected to grow at an 8% CAGR, with the strongest momentum in AI server boards (CAGR of about 20%). IC-Substrates are expected to expand with a 15% ...