Scientists report a record 2440 fold boost in two photon upconversion from 2D excitons, opening new paths for advanced photonic devices and energy research. (Nanowerk News) Scientists in China have ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Since their discovery at Drexel University in 2011, MXenes — a family of nanomaterials with unique properties of durability, conductivity and filtration, among many others — has become the largest ...

CNC or 3D printing? Why not both? Hybrid approaches combine subtractive and additive manufacturing processes to deliver precise outputs at greater speeds. In this piece, we’ll break down the basics of ...

TUCSON, Ariz. (KGUN) — Imaginations are coming to life for Pima JTED students in their new and improved 3D Animation, Virtual Reality (VR) and Game Design Laboratory. This program prepares students ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...

Copilot 3D can convert 2D images into 3D models that can be used in design tools. Copilot 3D can convert 2D images into 3D models that can be used in design tools. is a senior editor and author of ...

What if you could take a simple 2D image—a sketch, a logo, or even a photograph—and transform it into a fully realized 3D model, ready for 3D printing or digital design? For years, this process ...

J. Brodie Shirey is a Contributor from the United States who currently lives in York, Pennsylvania. He's just a simple man trying to make his way in the universe, but aren’t we all? Brodie is a big ...

Super Mario Odyssey director and Donkey Kong Bananza producer Kenta Motokura has said he wants there to be separate 2D and 3D branches of Donkey Kong just like with Mario. Donkey Kong as a series has ...

The mechanical strength and toughness of engineering materials are often mutually exclusive, posing challenges for material design and selection. To address this, a research team from The Hong Kong ...