IEEE

Multiphysics-Coupled Comparative Study of Bond-Wire and Clip Interconnections Aging in SiC Power Modules

Abstract: As the demand for higher power density in silicon carbide (SiC) modules increases, traditional bond wire interconnections (BWI) face significant reliability challenges, positioning copper ...
Yahoo Finance

xMEMS and Rayking Partner on Cypress + Alta-S Module to Accelerate Adoption of the World’s First Full-Range MEMS Speaker in Wireless Earbuds

SANTA CLARA, Calif., September 15, 2025--(BUSINESS WIRE)--xMEMS Labs today announced a strategic partnership with Dongguan Rayking Electronics Co., Ltd. to co-develop a turnkey Cypress + Alta-S ...
Morningstar

xMEMS and Rayking Partner on Cypress + Alta-S Module to Accelerate Adoption of the World’s First Full-Range MEMS Speaker in Wireless Earbuds

xMEMS and Rayking Partner on Cypress + Alta-S Module to Accelerate Adoption of the World’s First Full-Range MEMS Speaker in Wireless Earbuds xMEMS Labs today announced a strategic partnership with ...
TMCnet

xMEMS and Rayking Partner on Cypress + Alta-S Module to Accelerate Adoption of the World's First Full-Range MEMS Speaker in Wireless Earbuds

xMEMS Labs today announced a strategic partnership with Dongguan Rayking Electronics Co., Ltd. to co-develop a turnkey Cypress + Alta-S speaker module for next-generation TWS earbuds. The ...