EDN

Signal integrity and power integrity analysis in 3D IC design

The article explains the unique SI and PI challenges in 3D IC designs by contrasting them with traditional SoCs.
DIGITIMES

3D DRAM steps into AI inference: d-Matrix links with Alchip, Andes for Raptor build-out

Matrix completed a US$275 million Series C round in early November, raising its valuation to US$2 billion, and is speeding up ...
Calgary Herald on MSN

University of Calgary professor receives research leadership award for work on 3D mapping technology

A University of Calgary professor is receiving a Mitacs Innovation Award for Outstanding Research Leadership for his ongoing ...
IEEE

MENet: Multi-Modal Mapping Enhancement Network for 3D Object Detection in Autonomous Driving

Abstract: To achieve more accurate perception performance, LiDAR and camera are gradually chosen to improve 3D object detection simultaneously. However, it is still a non-trivial task to build an ...
IEEE

Stereo Vision SLAM for Real-time Underwater Dense 3D Mapping

Abstract: Visual Simultaneous Localization and Mapping (V- SLAM) still faces challenges in underwater environments, as existing methods often fail to deliver robust localization and globally ...