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India moved a step closer to ending its dependence on imported chip packaging technology on Sunday, with Odisha Chief Minister Mohan Majhi laying the foundation stone for the country’s first glass ...
BHUBANESWAR: Taking a major leap in its semiconductor ecosystem ambitions, the state government on Sunday laid the foundation stone for the country’s first advanced 3D chip packaging unit at ...
BHUBANESWAR: In a significant stride towards strengthening India’s semiconductor ecosystem, the foundation stone for the country’s first advanced 3D chip packaging unit was laid at Info Valley in ...
Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous integration ...
In a defining moment for India’s semiconductor ambitions and Odisha’s emergence as a future-ready technology destination, the foundation stone for the country’s first advanced 3D chip packaging unit ...
India’s push to build a complete semiconductor ecosystem has taken a decisive turn. On 19 April 2026, the country marked a significant milestone with the groundbreaking of its first advanced ...
The Tribune, now published from Chandigarh, started publication on February 2, 1881, in Lahore (now in Pakistan). It was started by Sardar Dyal Singh Majithia, a public-spirited philanthropist, and is ...
Odisha is emerging as a significant player in advanced sectors like electronics and semiconductors with the inauguration of India's first 3D glass substrate packaging facility. This Rs 1,943 crore ...
Heterogeneous Integration Packaging Solutions Pvt Ltd (3D Glass Solutions) kicked off work on Sunday on India’s first advanced 3D glass chip packaging unit at Info Valley in Bhubaneswar. This is one ...
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