GlobalFoundries announces plans to create a new centre for advanced packaging and testing of US-made essential chips.

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

Intel, the semiconductor giant, is once again the centre of rumours around potential buyers for its struggling chip business.

The 5G private network has been deployed under a Memorandum of Understanding (MOU) between the National Robotarium and ...

CES took place in Las Vegas earlier this month and highlighted the latest innovations and new trends for 2025.

Inelco Hunter has announced the availability of its new 7-inch Touch Display, featuring a 24 Bit RGB interface.

The additions include the G9EK-1-UTU and G9EK-1-E which provide compact yet high-capacity gasless interruption for large ...

Allegro MicroSystems has announced the launch of two new current sensor ICs - the ACS37030MY and the ACS37220MZ.

Altera, a developer of FPGA innovations, has launched the Altera Solution Acceleration Partner (ASAP) Program, an initiative ...

BrainChip has announced the availability of its Akida advanced neural networking processor on the M.2 form factor.

EPC, a leading developer of enhancement-mode gallium nitride (eGaN) power devices, has introduced the EPC91200 design.

Capable of delivering up to 5kV with up to 34 contacts in a compact Ø18 mm design, these connectors provide unmatched safety, ...