Compute-in-memory: State space models; ultra-thin AlScN memory; brain-inspired edge AI.
When Finland’s Donut Lab claimed earlier this year that it had developed a solid-state battery capable of storing 400 ...
Leveraging patterns in formal verification to reach sign-off faster.
Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.
AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...
Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.
Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...
Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.
Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.
The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...
Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...
Achieving energy-efficient AI systems will require pre-competitive, industry-wide collaboration on foundational capabilities.
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