Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...
QINGPU, SHANGHAI, CHINA, February 12, 2026 /EINPresswire.com/ — Introduction: The Foundation of Packaging Performance In the global packaging industry, substrate BOPP film (Biaxially Oriented ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Electronic waste and its associated pollution are becoming increasingly threatening on a global scale. With the continued development of various new application areas including robots, wearable ...
Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...
As technology nodes shrink, end users are designing systems where each chip element is being targeted for a specific technology and manufacturing node. While designing chip functionality to address ...
QINGPU, SHANGHAI, CHINA, February 12, 2026 /EINPresswire.com/ — Introduction: The Evolving Landscape of China’s BOPP Industry China’s BOPP (Biaxially Oriented Polypropylene) film manufacturing sector ...
Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...
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