Guoshi Technology has applied for a new patent regarding IGBT leakage testing, and this technology may change current testing methods. The patent indicates that the device employs a modular design, is ...

Structural irregularities in the body of an IGBT module can cause immediate or eventual electrical failure. These irregularities may be detected by three-dimensional acoustic micro imaging. A lack of ...

In June 2025, Gushi (Suzhou) Technology Co., Ltd. applied for a patent titled 'A Testing Device for Automotive-Grade Power Component IGBT Leakage Current'. The publication number of this patent is ...

Dissipated heat in a junction is one of the major effects that can influence the reliability of die-attach materials used in an IGBT’s chip. Power cycling tests are ideal to mimic the lifecycle of a ...

TOKYO, JAPAN. Saki Corp. has announced the introduction of its 3D-CT automated X-ray inspection (AXI) system designed specifically for the inspection and measurement of insulated gate bipolar ...