The article explains the unique SI and PI challenges in 3D IC designs by contrasting them with traditional SoCs.

When troubleshooting a complex device, knowledge is king. We want, and need, to know everything relevant to the issue, including the proper IC revision number, where to find relevant reference ...

The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization ...

IC analysis and certification lab Material Analysis Technology (MA-tek) has enjoyed a strong influx of MA (materials analysis) and FA (failure analysis) orders for AI chips and third-generation ...

3D-IC designs enable improvements in performance, power, footprint, and costs that cannot be attained in system-on-chip (SoC) and IC design. However, the leap from traditional SoC/IC design to 3D-IC ...

Demand for materials analysis (MA) and reliability analysis (RA) services remains robust for chips built using advanced process manufacturing and advanced packaging, according to industry sources.

Key opportunities in Saudi Arabia's power management IC market lie in sectors like consumer electronics, automotive, and IT & telecommunications. Growth will be driven by demand for efficient power ...