Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...
THE technical application of metals involves a detailed knowledge of their behaviour under external stresses. In the usual method of testing, measurements are made of the changes in external ...
Although engineering materials are normally used in their elastic range it is necessary to expose them to higher stresses if they are to be shaped into components. It is also necessary to know the ...
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