Broadcom (AVGO) said that it expects to sell at least 1M chips by 2027 based on its stacked design technology.

By Max A. Cherney SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech ...

The Capital Region has become an epicenter for research and manufacturing of so-called 3D, or stackable, computer chips, a ...

TDK said the DC-DC converter is already used in Altera’s Agilex family of FPGAs and AMD’s programmable SoCs, including ...