Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

Purpose Global, the world's leading Packaging Compliance and Sustainability Platform, today announced the launch of the Packaging Simulator, a first-of-its-kind tool that gives consumer brands ...

> Sanofi-aventis has implemented Lanner's process simulation software at a U.K. facility, following a pilot implementation that yielded $1.65 million in inventory cost savings in six months. Release ...

LONDON--(BUSINESS WIRE)--AVEVA, a global leader in industrial software, driving digital transformation and sustainability, has opened entries for its highly anticipated AVEVA Process Simulation ...

Chromatography is an important and ubiquitous unit operation in downstream bioprocessing. Currently, there are three different ways to pack process chromatography columns: • Flow packing, which uses ...