Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...
The semiconductor industry is under growing pressure to deliver more capable technologies while reducing development time, ...
PITTSBURGH, Nov. 19, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced it is integrating the NVIDIA Modulus AI framework into Ansys semiconductor simulation products to deliver AI ...
Photon Design, a developer of photonic simulation CAD software, has added a silicon modulator design capability to its HAROLD ...
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency, and performance of ...
A new technical paper titled “Achieving Sustainability in the Semiconductor Industry: The Impact of Simulation and AI” was published by researchers at Lam Research. “Computational simulation has been ...
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NVIDIA’s CUEST library is running TSMC’s chemistry simulations 50 times faster, accelerating new semiconductor material design
TSMC, the world’s largest contract chipmaker, is now running semiconductor chemistry simulations roughly 50 times faster than before by deploying NVIDIA’s cuEST library inside its fabrication ...
Semiconductor engineering teams have long relied on an iterative simulation workflow: define the scenario, prepare the model, run the analysis, review the results, adjust the design, and repeat until ...
From data centers powering next-generation AI to vital medical technology, cars, and the mobile device or computer you're ...
Integration of NVIDIA Modulus AI framework with the Ansys SeaScape platform will enable engineers to easily build customized AI solutions that can improve designer productivity and quickly identify ...
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