The Busan Metropolitan Office of Education (Superintendent Kim Seokjun) has opened a semiconductor education center where both front-end and back-end ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

The semiconductor industry continually pushes the boundaries of device performance through advanced process modelling and epitaxial growth techniques. In this context, sophisticated simulation methods ...

Rapidus has announced plans to establish a clean room at Seiko Epson's manufacturing facility in Chitose, Hokkaido, as well as a R&D center for semiconductor post-processing known as Rapidus Chiplet ...

Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach, in its first venture ...

The DSP-100 integrates Nikon's high-resolution semiconductor lithography technology with the multi-lens technology* 4 from its flat panel display (FPD) lithography systems. It delivers high resolution ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

Continued innovation in advanced packaging opens a clearer path to the outcomes the industry prioritizes. By tightening the physical distance between compute, memory, and interconnect, chipmakers ...

Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...