NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
New York, United States , April 16, 2024 (GLOBE NEWSWIRE) -- The Global RF Front End Module Market Size is to Grow from USD 24.56 Billion in 2023 to USD 83.21 Billion by 2033, at a Compound Annual ...
TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new NanoRF modules and contacts, which ...
RF Digital has released a fully FCC and CE-compliant 2.4GHz ULP wireless module in 15 by 15 by 3mm form factor powered by the nRF24LE1 ultra low power single chip transceiver, from wireless specialist ...
Main challenges facing RF designers. Design issues regarding PCBs, 5G, and regulations. Difficulties in finding RF engineering talent. Having been involved in developing products in virtually every ...
MIGDAL HAEMEK, Israel, Sept 10, 2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the production of Wi-Fi 7 RF front-end ...
POWAY, Calif.--(BUSINESS WIRE)--Cohu, Inc. (NASDAQ: COHU), a global leader in back-end semiconductor equipment and services, today announced the introduction of its RedDragon RF test module for 5G, Wi ...
With the exception of the iPhone, Apple's products largely lack technology to provide ubiquitous access to the outside world while on the go. However, a new proposal from the company would attempt to ...
Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...
Multi-protocol wireless is emerging as a critical foundation for IoT, as integrated chips balance power, performance and ...
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