Electrochemical Deposition (ECD) production system delivered to customer lineOmni x-series covering 310mm, 510mm, and 700mm platforms, enabling a broad range of panel-level manufacturing applications.

The system is designed for high-volume, rapid production of 3D packaging made from fibre-based materials.

Industry sources indicate that Taiwan-based panel maker Innolux has received orders occupying the entire capacity of its first-phase chip-first advanced fan-out panel level packaging (FOPLP) process.

Valmet expands its offering to the growing molded fiber market with the launch of Valmet 3D Fiber technology. The solution enables high-capacity, fast production of high-quality, three-dimensional ...

To address these challenges, MULTIVAC is extending its packaging and automation portfolio with the addition of GS Italia ...

Biodegradable packaging from mycellium and agriculture waste produced by S.Lab for Loreal. A German pharmacist invented polystyrene in 1839. Today, the production of polystyrene produces more than ...

Companies building the largest AI accelerators face a growing cost problem that has nothing to do with transistors. The ...

Subscribe to our newsletter for the latest sci-tech news updates. A team in the Department of Sustainable Biomaterials developed a water-based process to create multilayer bioplastic films that are ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. Ever since former Intel CEO Pat Gelsinger announced in 2021 that Intel was entering the ...