The Turbo Package Analyzer TPA v5 IC packaging tool features a new automation, design flow, and simulation capability needed to extract the electrical characteristics of complex high-performance BGA ...
Packaging News talks to Serge Batkam, founder and managing director of Pack 3.0 about science-based digital twins, ...
“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...
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