This application note provides the PCB design and SMT assembly guidelines for Maxim Integrated’s leaded packages (SOIC, TSSOP, QSOP, QFP, SC70, SOP, SOT, etc.). Leaded packages are surface-mount ...
Considerations for dividing analog and digital blocks. Decoupling techniques. Breaking down the board layers. How best to deal with grounding. Similar to building a house, it’s essential to create a ...
This white paper is designed to guide you through the intricacies of rigid-flex printed circuit board (PCB) design. In today’s electronics industry, there has never been more demand for compact, ...
Analog circuit design guidelines. Digital circuit design guidelines. Differences in the guidelines between the two. Several products in the electronics industry require both analog and digital printed ...
One problem with writing an Application Note on PCB layout is that the people who read it are usually not the ones who are going to use it. Even if the designer has struggled through electromagnetic ...
JarnisTech, a leader in high-end multi-layer and specialized material PCB solutions, provides flexible, cost-effective, and ...
US industry body IPC has released a standard for the current capacity of tracks on PCBs. Called IPC-2152 ‘Standard for Determining Current-Carrying Capacity in Printed Board Design’, it is a 97page ...
Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package-on-package technology. New ways of working with sub-assembly printed ...
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