New validation solutions enable data center operators to overcome bandwidth, latency, and interoperability challenges as AI ...

Teradyne TER is benefiting from the growing demand for memory test solutions, particularly driven by advancements in AI applications and data center investments. In the third quarter of 2025, the ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (TER) (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of the Magnum 7H, a ...

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

Samsung has advanced LPDDR5X-PIM memory technology and commenced HBM4 mass production as it battles SK Hynix to regain its AI memory market leadership.

Explosive growth of generative artificial intelligence (AI) applications in recent quarters has spurred demand for AI servers and skyrocketing demand for AI processors. Most of these processors — ...

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...