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AMD's future 'Medusa Halo' APUs could use LPDDR6 RAM — new leak suggests Ryzen AI MAX 500 series could have 80% more memory bandwidth
Sometime in 2027 to 2028, AMD could release Medusa Halo, its next-gen entry in the high-performance Halo APU lineup. It's ...
AMD's next-generation 'Halo' APU seems likely to use bleeding-edge LPDDR6 memory for nearly double the bandwidth.
Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now ...
The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...
With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...
TL;DR: Samsung Electronics advances its next-gen HBM4E memory with 13Gbps per-pin speeds, delivering up to 3.25TB/sec bandwidth-over 2.5 times faster than HBM3E-and doubling power efficiency. Targeted ...
Memory chips used to be considered low-margin commodity products. Now the industry can’t make enough to satisfy data centers’ ...
Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...
Memory, especially High Bandwidth Memory, plays an important role in ensuring AI workloads run efficiently and fast, reducing ...
Samsung has started early mass production of HBM4 chips for Nvidia's next AI platform. Micron Technology (NasdaqGS:MU) is not included as an HBM4 supplier for this Nvidia platform. This development ...
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