Based on 1.58 million projects: the first platform-level dataset on how online packaging designs split between 3D ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...

OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...

What do you think packaging design will look like in 2024? In the next year, packaging design will continue to evolve and surpass the limitations imposed by traditional shelf-space categories. With ...

Dezeen Competitions: The Salmon Packaging Design Competition tasks designers with creating innovative packaging using corrugated cardboard sourced from sustainable and renewable materials. The ...

Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...