The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...
Sponsored by Vitrek, LLCReviewed by Maria OsipovaSep 18 2025 Wafer lapping is a vital semiconductor thinning operation that requires precise control to avoid over-removal of material, which can result ...
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