Design-Reuse

Actel Introduces Land Grid Array Packaging Option for Radiation-Tolerant RTAX-S FPGA Family

Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...
The Engineer

Land Grid Array Capacitors Achieve High-Frequency Performance

Land Grid Array capacitors from AVX have achieved, thanks to patented design innovations, the equivalent high-frequency performance of complex 8-terminal Inter- Digitated Capacitors in a simple ...
Tech Digest

Ball Grid Array Soldering Explained

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.
Semiconductor Engineering

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
Semiconductor Engineering

Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...