Sandisk and SK hynix push High Bandwidth Flash (HBF) standard via OCP to cut AI inference costs and boost scalability.

Micron stock exhibits robust momentum, strong margins, healthy cash flow, a low-debt capital structure, and favorable market ...

Micron Technology (NasdaqGS:MU) plans to invest up to US$200b through 2030 to expand U.S. memory chip capacity focused on AI infrastructure. The company has started shipping its next generation HBM4 ...

SK Hynix and Sandisk introduce High Bandwidth Flash under OCP, targeting AI inference with up to 1.6 TB/s bandwidth and 16× HBM capacity.

AI data centre demand is overwhelming memory supply, sending DRAM and NAND prices soaring and lifting Korean chip stocks — ...

Samsung ships HBM4 memory at 11.7Gbps speeds and claims an early industry lead ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

No joke, but maybe a little funny.

What is the Market Size of Memory Wafer? BANGALORE, India, Feb. 24, 2026 /PRNewswire/ -- The Global Memory Wafer Market was valued at USD 58470 Million in the year 2024 and is projected to reach a ...

Micron has been one of the biggest winners in the AI boom.

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...