BEIJING, Oct. 23, 2025––WiMi Hologram Cloud Inc. (NASDAQ: WiMi) ("WiMi" or the "Company"), a leading global Hologram ...
As semiconductor technologies advance, device structures are becoming increasingly complex. New materials and architectures introduce intricate physical effects requiring accurate modeling to ensure ...
A new technical paper titled “DiffChip: Thermally Aware Chip Placement with Automatic Differentiation” was published by researchers at MIT and IBM. “Chiplets are modular integrated circuits that can ...
A hybrid fuzzy neural network model enhances prediction accuracy of hardness properties in high-performance concrete, addressing complex material behaviors.