Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

A defect in a semiconductor chip may be smaller than a human hair but can create big problems in your everyday life, from crippling your car's steering to making your laptop more susceptible to ...

To further shrink electronic devices and to lower energy consumption, the semiconductor industry is interested in using 2D materials, but manufacturers need a quick and accurate method for detecting ...

In the steel industry, especially alloy steel, creating different defected product can impose a high cost for steel producers. One common defect in producing low carbon steel grades is Pits & Blister ...

A joint research team led by Dr. Hee-Eun Song of the Photovoltaics Research Department at the Korea Institute of Energy Research (President Yi Chang-Keun, hereafter “KIER”) and Prof. Ka-Hyun Kim of ...