Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...
Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
Diamond saw blades are created by gluing diamond grit towards the blade's steel body, resulting in a harder, more robust blade capable of cutting even the hardest materials. Diamond is one of the ...
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