Additive manufacturing (AM) is evolving beyond prototyping to enable end-use parts production across a range of applications. Much has changed to enable this, including the development of AM processes ...
VANCOUVER, BC, Sept. 14, 2020 /PRNewswire/ - Ballard Power Systems (NASDAQ: BLDP) (TSX: BLDP) today announced the launch of its FCgen®-HPS product, a high-performance, zero-emission, proton exchange ...
Moore’s Law scaling is slowing down and limited improvements in performance, power, area, and cost are available from one process node to the next. As a result, advanced packaging and 3D stacking ...
Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
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