As semiconductor components continue to shrink, the challenges associated with design-for-manufacturing (DFM) and design-technology co-optimization (DTCO) increase. The complexity of the IC design and ...

With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...

Electronics design engineers spend substantial effort on schematics, simulation, and layout. Yet, a component’s long-term success also depends on how well its physical form aligns with downstream ...