Intel's custom chip business is taking off.

Broadcom is set to lead AI server compute ASIC design with 60% share by 2027 as hyperscalers scale TPUs/Trainium/Maia.

Amazon, Microsoft and Apple are rapidly expanding custom AI chips to power data centers, with shipments expected to triple by 2027 as demand for faster, more efficient AI grows.

IC sense opens a new Electronic Wafer Sort (EWS) cleanroom to expand its in‑house ASIC production capabilities.

TL;DR: Broadcom secured a $10 billion custom ASIC contract from a major non-CSP client, with Apple, xAI, and ByteDance also in line. OpenAI's custom AI chip, produced with Broadcom and TSMC, aims to ...

The most efficient chip in the room wins-and Broadcom is betting its future on that truth. In the high‑stakes race to build AI infrastructure, the company has emerged as a critical supplier of custom ...

AI now drives over 50% of Broadcom's semiconductor revenue, transforming its growth profile and making Networking and custom ASICs the core of its business. Broadcom's Ethernet networking chips and ...

Broadcom (NASDAQ:AVGO) and OpenAI have launched a multi-year partnership to deploy 10 gigawatts of custom artificial intelligence silicon and rack-level systems, integrating compute ...

Cloud service providers are accelerating in-house ASIC development to gain tighter control over performance and costs. DIGITIMES projects that between 2025 and 2029, the compound annual growth rate ...

Broadcom received another in a string of analyst upgrades today following last week's earnings report. The landing of OpenAI as an ASIC customer is causing a stir in the generative AI industry.