The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...
Our appetite for new gadgets is resulting in a huge e-waste problem, with just a fraction of the 50 million tonnes of tech thrown away each year being recycled. Looking to tackle a significant part of ...
The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...
Semiconductor substrate warpage and signal loss now have a Korean challenger to glass: Viacore and Aqlaser’s low-CTE ...
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