System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

MAINBOARD-LISTED Nico Steel Holdings on Monday said it has received approval for its patent on the electroplating process of an aluminium alloy with copper, for a period of 20 years, starting from ...

Fraunhofer ISE development also uses recyclable aluminum for masking – removing need for problem polymers. Thin copper contacts mean the silicon layer does not experience much shading. The rising ...

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...