“The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold ...

The smart use of technology can improve your packaging, helping to give you an edge in the competitive market. By using modern technology rather than only using traditional packaging methods, you can ...

Trends in next-generation battery packaging architectures. Optimizing packaging space with cell-connecting systems. Novel solutions for solving EMI, thermal management, and range-anxiety challenges.

A comprehensive assessment sought to evaluate the potential environmental impacts of replacing polyethylene, or PE, packaging like bags, films and containers with alternative materials, including ...