When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical ...

Failure analysis is one of the best tools for any aerospace supplier or manufacturer. The scientific method-based approach to establishing cause and effect can be used across all phases of a product's ...

These developments continue to fuel growing investment into the technology and manufacture of semiconductor devices at both industrial and academic research levels. Improvements in technology, ...

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

Failure analysis is the scientific process of determining the root cause of a failure. It is often related to equipment breakdown with varying levels of consequence, from loss of production, to ...

Each phase of a project has unique failure signature patterns. Just like the bathtub curve in Figure 2, we see more “failures” in the initial design, development and early production “ramp up” phase.

Whether plastic or metal, every kind of gear loses its luster and capabilities in time. Wear and tear erode them in various ways, leading to performance declines. Fortunately, knowing the most ...

Failure analysis labs are becoming more fab-like, offering higher accuracy in locating failures and accelerating time-to-market of new devices. These labs historically have been used for ...