Matlantis has announced the integration of the NVIDIA ALCHEMI Toolkit into its platform, marking a significant advancement in ...
Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...
China-based EDA leader Empyrean Technology and Shanghai UniVista Industrial Software Group have jointly announced their collaboration to build a digital-analog mixed design and simulation EDA solution ...
Cadence’s dual announcements with NVIDIA and Google mark pragmatic steps in the industry’s transition toward intelligent, ...
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Xoomsys, a Cupertino, Calif company that makes a product to allow simulation of dynamic coupling effects in semiconductor design, has raised $8 million in a second round of funding. New investor DAG ...
Engineers and EDA tool providers have been in a long-term conversation on how to improve design insight and better predict system behavior prior to prototyping. Best-in-class strategies to design ...
Simulation is playing an increasingly critical and central role throughout the design-through-manufacturing flow, fusing together everything from design to manufacturing and test in order to reduce ...
Nvidia Corp. NVDA is helping robotics companies scale physical artificial intelligence into real-world industrial applications, introducing new models and frameworks in March designed to move AI ...
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