Say you wanted to create a chip in which a processor fabricated in 32-nm process rules would be combined with memory done on a 65-nm process and analog blocks fabricated at 180 nm. This leads you to ...
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Rapidus on Friday announced that it had begun prototyping of test wafers with 2nm gate-all-around (GAA) transistor structures at its IIM-1 facility in Japan. The company confirmed that early test ...
Apple chipmaker TSMC has announced plans to produce highly advanced 1.6nm chips that could be destined for future generations of Apple silicon. TSMC yesterday unveiled a series of technologies, ...
Although Advanced Micro Devices (AMD) keeps plans to change its chip making methods locked up tight, analysts are warning that delays by AMD in moving to a larger chip wafer could deal a significant ...
Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...
Cerebras Systems and the federal Department of Energy's National Energy Technology Laboratory today announced that the company's CS-1 system is more than 10,000 times faster than a graphics processing ...
The Benefits Of Curvilinear Full-Chip Inverse Lithography Technology With Mask-Wafer Co-Optimization
A technical paper titled “Make the impossible possible: use variable-shaped beam mask writers and curvilinear full-chip inverse lithography technology for 193i contacts/vias with mask-wafer ...
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